motherboard chip soldering machine ,bga chips soldering machine, infrared bga rework station

Specifications

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12 months fully factory warranty

T-962A bga chips soldering machine, infrared bga reflow oven

Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate; 

Fast infrared and hot air heating, make temperature more accurate and evenness. Fuzzy temperature control 

technology, visualization drawer, can see the whole soldering process very clearly. It can achieve soldering 

of single and double-sides PCB board.

Technical parameters 

Soldering area: 300*320mm

Overall dimensions: 43*37*26cm

Packing dimensions: 51*45*33cm

Power: 1500W

Cycle time: 1-8 min

Voltage: AC110V-AC220V /50-60HZ

Net weight: 12.5Kgs

Gross weight: 15Kgs

FEATURES

(1) Large infrared soldering area

Soldering area: 300*320mm (T-962A); 

this increases the usage range of this machine drastically and makes it an economical investment.

(2) Choice of different soldering waves

Parameters of eight soldering waves are predefined and the entire soldering process can completed 

automatically from Preheat, Soak and Reflow through to cool down.

(3) Special heat up and temperature equalization with all designs

Big power of energy efficient Infrared heating and air circulation to re-flow solder.

(4) Ergonomic design, practical and easily operated

Good build quality but at the same time light weight and a small footprint allows the T962C to be easily 

bench positioned transported or stored.

(5) Large number of available functions

Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. 

It is the ideal rework solution from single runs to on-demand small batch production.

Warranty

Warranty – the main body maintains for one year and the spare parts maintains for three months.

Service – provide the immediate network online Q/A and the technical advisory work service